5-Year Warranty, Guaranteed Reliability

*The service will follow the local standard and service policy.

 

 

 

Ultimate-speed 10Gbps with USB 3.1 onboard	Dual onboard M.2 for up to 32Gbps transfers
With three USB 3.1 Type-A ports for complete backward-compatibility with existing USB devices and one reversible 3.1 Type-C for any-way-up convenience, you're all ready for breakneck speeds of up to 10Gbps.	TUF Z270 Mark 1 features two built-in M.2 connectors — both of which support Intel Rapid Storage Technology and RAID configurations for transfer speeds of up to 32Gbps, automatic application refreshes, and exceptionally fast wake-up from sleep!
Accelerated networking with Turbo LAN	INTEL OPTANE Memory Ready
Even the slightest delay can affect performance — and that's why TUF Z270 Mark 1 has Turbo LAN. Advanced “traffic-shaping” technology reduces lag, so everything you do feels faster and smoother. And you don't need to be an expert: Turbo LAN's simple interface means it takes just a few clicks to reduce lag by up to 1.45x!	Intel® Optane™ memory* is a revolutionary (non-volatile memory) technology supported by TUF Z270 Mark 1. Optane Memory modules accelerate attached storage to reduce boot times and to speed application launches — making everything faster and smoother, so you're more productive than ever!

Outstanding Audio – In and Out

TUF Z270 Mark 1 features Realtek S1220A, an audio codec developed by Realtek especially for ASUS. Along with this unique codec, TUF Z270 Mark 1 features a 120dB SNR stereo line-out with built-in amplifier and a studio-grade 113dB SNR line-in to deliver pristine audio playback and recording.

Audio shielding Specially designed audio shielding ensures precision analog/digital separation, greatly reducing multi-lateral interference.	Pop-reducing circuit A unique pop-reducing circuit reduces start-up popping noise to all audio outputs.	Internal amplifier Internal audio amplifier produces the highest-quality sound for headphone and speakers.
Dedicated channel layouts Separate layers for left and right channels provide discrete paths that ensure audio quality.	DTS Headphone:X Immersive 3D surround-sound technology provides incredibly rich audio experiences.	Japanese-made audio capacitors Premium capacitors provide warm, natural, immersive sound with exceptional clarity and fidelity.

3D Printing Friendly  Make it your own   ASUS is the first motherboard manufacturer to support 3D printing, making it easy to customize your motherboard's appearance and improve system performance with a range of printable parts. Simply swapped 3D-printed parts TUF Z270 Mark 2 is made for 3D printing. Your 3D-printed parts — such as custom nameplates or M.2 armor — are easily swappable using the existing space and mounting holes – for a truly individual build.

3D-printable accessories

As system parts are visible in custom PC builds, make yours stand out from the competition with 3D-printed accessories.

Cable combs Keep cables organized with the multi-connector design. 3D design files are available for 24-pin, 8-pin, 8 + 6-pin, 6-pin and 4-pin PSU cnnectors

Fan grill Add a little extra style to your build.

2-Way SLI HB bridge cover Clip the cover onto the PCB SLI HB bridge to add style to your build. Multiple form factors — eATX, ATX and mATX — are available.

 

 

 

Intel CPU and Chipset Features

 

Intel® Z270 Chipset

Intel® Z270 is a single-chipset design that supports 7th Generation and 6th Generation Intel LGA1151 Core™i7/Core i5/Core i3/Pentium® /Celeron®processors. It provides improved performance by utilizing serial point-to-point links, allowing increased bandwidth and stability. Additionally, the Z270 provides a maximum of 10 USB 3.0 ports, six SATA 6Gb/s ports, and 32Gb/s M.2 and PCIe 3.0 lane speed support, for faster data retrieval. Intel Z270 also supports integrated graphics, so you'll enjoy the very latest in graphics performance.

Ready for 7th Generation and 6th Generation Intel LGA1151 Core i7/Core i5/Core i3/Pentium/Celeron processors

TUF Z270 Mark 2 supports 7^th Generation and 6^th Generation Intel Core i7/i5/i3/Pentium^®/Celeron^® processors in the LGA1151 package, with graphics, memory and PCI Express controllers integrated to support onboard graphics output with dedicated chipsets, two-channel (4-DIMM) DDR4 memory, and 16 PCI Express 3.0/2.0 lanes..